Friday, 24 January 2014

ResearchMoz include new market research report"3D ICs (MEMS and sensors, RF SiP, Optoelectronics and imaging, Memories, Logic, HB LED) Market - Global Industry Analysis, Size, Share, Growth, Trends, and Forecast, 2013 - 2019" to its huge collection of research reports.

This report analyzes the 3D ICs market on a global basis, with further breakdown into various sub-segments. It provides cross-sectional analysis of the market based on parameters such as geography, system type, applications and networking technology. The analysis covers market estimates in terms of revenue and forecast for the period of 2013 to 2019.

The global 3D ICs market is going through a phase marked with complexity of technology and low awareness. Industries in this market need to effectively balance their expenditure between technology advancement and capacity expansion. The 3D ICs market is yet to achieve complete recognition. Its successful penetration into various end-user sectors is mainly administered by research and development initiatives. There are variations in growth pattern across different geographies. These variations exist in terms of technologies used and applications preferred. This report is thereby produced to give a detailed overview of the ongoing trends in the market. It includes a review of market dynamics with focus on market drivers, growth challenges (restraints), and opportunities. The value chain analysis and Porter’s five forces analysis included in the report further help in assessing the market situation and competitiveness. Market attractiveness analysis highlights key segments of the market and their comparative attractiveness against other segments.

View Full Report With Complete TOC at

Table of content

Chapter 1 Preface
1.1 Report description and scope
1.1.1 Market segmentation
1.2 Research methodology

Chapter 2 Executive Summary
2.1 Global 3D ICs market snapshot, 2012 & 2019
2.2 Global 3D ICs market, 2011 – 2019 (USD million)

Chapter 3 3D ICs Market Overview
3.1 Introduction
3.2 Market dynamics
3.2.1 Drivers Growing demand for efficient solutions Rise in number of portable devices
3.2.2 Restraints High cost, thermal and testing issues
3.2.3 Opportunities Big Data and predictive analytics
3.3 Trends and future outlook
3.3.1 Multi-chip packaging
3.3.2 IntSim
3.4 Value chain analysis
3.4.1 Inbound logistics
3.4.2 Operations
3.4.3 Out-bound logistics
3.4.4 Marketing, sales and services
3.5 Porter’s five forces analysis
3.5.1 Bargaining power of suppliers
3.5.2 Bargaining power of buyers
3.5.3 Threat of substitutes
3.5.4 Threat of new entrants
3.5.5 Degree of competition
3.6 Technology overview
3.6.1 Shift to 3D IC from 2.5D IC technology
3.6.2 3D IC fabrication processes
3.6.3 Standards issues at different levels of 3D IC production
3.6.4 Patent filings
3.7 Market attractiveness analysis
3.8 Competitive analysis
3.8.1 Market share of key players, 2012 (%)

Chapter 4 Global 3D ICs Market, by End-Use Industry
4.1 Global 3D ICs market overview, by end-use industry, 2012 & 2019 (%)
4.2 Consumer electronics 3D ICs market, 2011 – 2019 (USD million)
4.3 Information and communication technology 3D ICs market, 2011 – 2019 (USD million)
4.4 Transport (automotive and aerospace) 3D ICs market, 2011 – 2019 (USD million)
4.5 Military 3D ICs market, 2011 – 2019 (USD million)
4.6 Others (Biomedical applications and R&D) 3D ICs market, 2011 – 2019 (USD million)

Chapter 5 Global 3D ICs Market, by Substrate Type
5.1 Global 3D ICs market overview, by substrate type, 2012 & 2019 (%)
5.2 Silicon on insulator (SOI) 3D ICs market, 2011 – 2019 (USD million)
5.3 Bulk silicon 3D ICs market, 2011 – 2019 (USD million)

Chapter 6 Global 3D ICs Market, by Fabrication Process
6.1 Global 3D ICs market overview, by fabrication process, 2012 & 2019 (%)
6.2 Beam re-crystallization 3D ICs market, 2011 – 2019 (USD million)
6.3 Wafer bonding 3D ICs market, 2011 – 2019 (USD million)
6.4 Silicon epitaxial growth 3D ICs market, 2011 – 2019 (USD million)
6.5 Solid phase crystallization 3D ICs market, 2011 – 2019 (USD million)

Chapter 7 Global 3D ICs Market, by Product
7.1 Global 3D ICs market overview, by product, 2012 & 2019 (%)
7.2 MEMS and sensors 3D ICs market, 2011 – 2019 (USD million)
7.3 RF SiP 3D ICs market, 2011 – 2019 (USD million)
7.4 Optoelectronics and imaging 3D ICs market, 2011 – 2019 (USD million)
7.5 Memories (3D Stacks) 3D ICs market, 2011 – 2019 (USD million)
7.6 Logic 3D SiP/SoC 3D ICs market, 2011 – 2019 (USD million)
7.7 HB LED 3D ICs market, 2011 – 2019 (USD million)

Chapter 8 Global 3D ICs Market, by Geography
8.1 Global 3D ICs market overview, by geography, 2012 & 2019 (%)
8.2 North America 3D ICs market, 2011 – 2019 (USD million)
8.3 Europe 3D ICs market, 2011 – 2019 (USD million)
8.4 Asia Pacific 3D ICs market, 2011 – 2019 (USD million)
8.5 RoW 3D ICs market, 2011 – 2019 (USD million)

Chapter 9 Company Profiles
9.1 Taiwan Semiconductor Manufacturing Company, Ltd.
9.1.1 Company overview
9.1.2 Financial overview
9.1.3 Business strategies
9.1.4 Recent developments
9.2 XILINX, Inc.
9.2.1 Company overview
9.2.2 Financial overview
9.2.3 Business strategies
9.2.4 Recent developments
9.3 The 3M Company
9.3.1 Company overview
9.3.2 Financial overview
9.3.3 Business strategies
9.3.4 Recent developments
9.4 STATS ChipPAC Ltd.
9.4.1 Company overview
9.4.2 Financial overview
9.4.3 Business strategies
9.4.4 Recent developments
9.5 Tezzaron Semiconductor Corporation
9.5.1 Company overview
9.5.2 Financial overview
9.5.3 Business strategies
9.5.4 Recent developments
9.6 United Microelectronics Corporation
9.6.1 Company overview
9.6.2 Financial overview
9.6.3 Business strategies
9.6.4 Recent developments
9.7 Ziptronix, Inc.
9.7.1 Company overview
9.7.2 Financial overview
9.7.3 Business strategies
9.7.4 Recent developments
9.8 Elpida Memory, Inc. (Micron Technology, Inc.)
9.8.1 Company overview
9.8.2 Financial overview
9.8.3 Business strategies
9.8.4 Recent developments
9.9 MonolithIC 3D Inc.
9.9.1 Company overview
9.9.2 Financial overview
9.9.3 Business strategies
9.9.4 Recent developments

Upcoming Reports:

Gonorrhea Diagnostic Market - Global Industry Analysis, Size, Share, Growth, Trends and Forecast, 2013 - 2019

View Full Report -

Gonorrhea is a contagious sexually transmitted disease caused by the bacterium Neisseria gonorrhoeae. The disease can also pass on to a new born through infected mother during parturition. This disease can affect both men and women. The bacterium grows in warm and moist areas of uterus, reproductive tract, fallopian tubes and urethra. In addition, the bacterium can also grow in the throat, mouth and anus. According to Center for Disease Control (CDC), in 2010 the total number of people suffering from gonorrhea was estimated to be around 3 lacs in the U.S. Diagnostic tests for...

Photonic Integrated Circuit Market - Global Industry Size, Share, Trends, Analysis, and Forecast, 2012 - 2018

View Full Report -

A photonic integrated circuit or PIC is a device that integrates a number of photonic functions and is analogous to an electronic integrated circuit. PIC is a breakthrough technology as it uses photons as a data carrier rather than electrons. As light travels at a high speed, photonic integrated technology is extensively used for transferring huge amount of data at high speed. Hence, PIC technology based products are largely used in optical fiber communication.  The photonic integrated circuit market is growing at a phenomenal rate due to the significant...

About ResearchMoz 

ResearchMoz is the one stop online destination to find and buy market research reports & Industry Analysis. We fulfill all your research needs spanning across industry verticals with our huge collection of market research reports. We provide our services to all sizes of organizations and across all industry verticals and markets. Our Research Coordinators have in-depth knowledge of reports as well as publishers and will assist you in making an informed decision by giving you unbiased and deep insights on which reports will satisfy your needs at the best price.

For More Information Kindly Contact:


Post a Comment